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Spiral Inductors(Bare Die)

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HX1360900A

Product Data Sheet

Overview

HX1360900A series of spiral inductors are formed by photolithography and plating techniques on fused quartz substrates. They eliminate the need for hand forming and “staking” of coil in hybrid circuits. They provide uniformity, durability and repeatability in circuit fabrication. The coils are SiN coated to protect from ambient contaminants, and to eliminate the need for conformal coating. Quartz substrates are rugged to reduce dielectric losses. Chips may be bonded using either conductive or non conductive epoxies, and wire bonded with gold wire or ribbon by thermo-compression bonding. 

Parameters

* Fabricated by Semiconductor Lithography Process 

* Compatible with Micro-Assembly Process 

* Protection with Passivation Layer String Environmental Adaptability 

* Precise Overall Dimensions 

* Stable Batch Parameters

Application

* Microwave Hybrid Integrated Components 

* VCO 

* Pin Switch